| 摘要 |
The present disclosure is directed to an apparatus for forming a film on a wafer which comprises a container means adapted to be hermetically sealed, a shaft means disposed for rotation in said container means, a first and second plate means fixed to said shaft means in a spaced-apart relationship, said first plate means adapted to support said wafer and pipe means for introducing a reaction gas into the container means, one end portion of said pipe means being placed between the first and second plate means.
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