| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit chip which can restrain a through current caused by the floating contact of an input pad when each semiconductor integrated circuit chip is not electrically connected via a pad, and can carry out a conduction test of a pad (electrode) for electrically connecting each semiconductor integrated circuit chip in a semiconductor integrated circuit device in non-contact with the pad. SOLUTION: A switch for switching a conduction state and a non-conduction state is provided between an output pad and an input pad for electrically connecting each semiconductor integrated circuit chip, and the generation of a through current is prevented in the input pad by bringing the output pad and the input pad into a conduction state. Therefore, operation recognition such as mass production inspection can be carried out in each discrete semiconductor integrated circuit chip. COPYRIGHT: (C)2004,JPO
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