| 摘要 |
PROBLEM TO BE SOLVED: To provide cooling circuits for a semiconductor manufacturing device in which the influence of a magnetic field generated from a flow of a cooling medium is reduced. SOLUTION: A cooling device cools the semiconductor manufacturing device (10) for processing a wafer (W) under plasma gas atmosphere or electric field atmosphere by a cooling medium such as water. Each of cooling circuits (20, 30, and 40) is constituted of a 1st channel (27) for flowing the cooling medium in an optional direction and a 2nd channel (28) having approximately the same length to flow the cooling medium in the reverse direction against the flowing direction of the 1st passage (27), the 1st and 2nd channels (27, 28) are adjacently arranged and a magnetic field generated by the cooling medium flowing in the 1st channel (27) and the 2nd channel (28) is cancelled at the outside of the cooling circuit to reduce the influence of the magnetic field. Consequently various kinds of processing for manufacturing semiconductors can be suitably and stably performed. COPYRIGHT: (C)2004,JPO |
