发明名称 DIELECTRIC LAYER PATTERNING METHOD, THIN FILM EL ELEMENT MANUFACTURING METHOD AND THIN FILM EL ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a thin film EL element with a dielectric layer and a sol-gel dielectric layer added thereto, having low cost, good productivity, no defect and high reliability by preventing the removal of the sol-gel dielectric film deposited on a unnecessary portion due to the addition of the sol-gel dielectric layer and the separation or breakage of a lower electrode layer due to the separation of the sol-gel dielectric film deposited on the unnecessary portion during processing. SOLUTION: The thin film EL element comprises an electrically insulating substrate, the lower electrode layer having a pattern on the substrate, the dielectric layer for covering at least part of the lower electrode layer, and at least a luminous layer and an upper electrode layer laminated on the dielectric layer, at least one of the lower and upper electrode layers being a transparent electrode layer, the dielectric layer having a layered structure including the dielectric layer formed by at least solution coating firing. A thin film EL element manufacturing method comprises calcining the dielectric layer formed by the solution coating firing at a non-crystallizing temperature, followed by patterning and firing. The thin film EL element is manufactured in this method. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003323981(A) 申请公布日期 2003.11.14
申请号 JP20020130006 申请日期 2002.05.01
申请人 TDK CORP 发明人 UEMATSU KATSUYA;OKOBA MINORU;MIWA MASASHI;SHIRAKAWA YUKIHIKO
分类号 H05B33/10;H05B33/22;H05B33/26;(IPC1-7):H05B33/10 主分类号 H05B33/10
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