发明名称 GRAIN FOR POLISHING METAL SUBSTRATE AND ABRASIVE
摘要 <p><P>PROBLEM TO BE SOLVED: To polish a metal substrate at a sufficiently high polishing speed and high polishing accuracy even when an oxidizer is not blended in an abrasive. <P>SOLUTION: Hydrogen peroxide, peracetic acid, urea-hydrogen peroxide, urea peroxide, peroxotitanic acid, and their mixtures are suitably used as components having oxidation performance, and especially the peroxotitanic acid and its mixture are preferable. The content of these components having the oxidation ability is preferably in a range of 0.1 to 20 wt.%. When the content is less than 0.1 wt.%, the oxidation ability is reduced and a sufficiently high polishing speed can not be obtained, and when the content exceeds 20 wt.%, the adsorption and carrying of these components by inorganic oxide grains become difficult, or some components out of these components may be separated from the polishing grains into a dispersion medium in the abrasive. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003324083(A) 申请公布日期 2003.11.14
申请号 JP20020129519 申请日期 2002.05.01
申请人 CATALYSTS & CHEM IND CO LTD 发明人 NAKAYAMA KAZUHIRO;NAKAJIMA AKIRA;KOMATSU MICHIO
分类号 B24B37/00;C09K3/14;H01L21/304;(IPC1-7):H01L21/304 主分类号 B24B37/00
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