| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material which is used for sealing, has an excellent property for preventing insulation failures caused by conductive substances, and can correspond to the narrow pad pitch, multi-pins, and the like of semiconductor devices, and to provide an electronic part device, such as semiconductor device, which is sealed with the material and hardly causes the failures of electric characteristics. SOLUTION: This epoxy resin molding material which is used for the sealing comprises (A) an epoxy resin, (B) a curing agent, (C) carbon black and (D) inorganic particles, wherein (C) the carbon black is partially or wholly immobilized on (D) the inorganic particles. COPYRIGHT: (C)2004,JPO |
