发明名称 METHOD AND APPARATUS FOR ELECTRICAL TREATMENT SUCH AS ELECTROPLATING
摘要 PROBLEM TO BE SOLVED: To provide a method and apparatus for electrical treatment such as electroplating which is suitably used for example, for the electrical treatment such as electroplating and in which each process is safely and reasonably performed using super critical or subcritical carbon dioxide, and carbon dioxide, a treating liquid and the like after being used are safely, reasonably and rapidly treated, the quantity of a pickling solution, a plating solution or the like to be used is reduced, the waste water produced by the plating is decreased and recycled to prevent the environmental pollution to improve the working environment and the productivity, the throwing power of the plating is remarkably improved and fine finish is attained. SOLUTION: A super critical or subcritical state is formed in a reaction vessel 1 housing electrolytic materials and an electrolyte solution. An electrode material 3 is electrolyzed under the critical state or subcritical state or the electrolyzed electrode material and/or the electrolytic materials contained in the electrolyte solution are deposited and stuck on the other electrode material 4. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003321798(A) 申请公布日期 2003.11.14
申请号 JP20000401301 申请日期 2000.12.28
申请人 YOSHIDA HIDEO;MIYATA SEIZO;ASAI YOSHIHIRO 发明人 YOSHIDA HIDEO;MIYATA SEIZO;SONE MASATO;IWAO FUMIKO;ASAI YOSHIHIRO;ASAI HIROSHIGE
分类号 B01J3/00;C25D17/00;(IPC1-7):C25D17/00 主分类号 B01J3/00
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