| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding sheet for laminated layer plate including an internal layer circuit which can contribute to the wide range control of thermal expansion coefficient of a build-up wiring plate, to provide a laminated layer plate including the internal layer circuit using the bonding sheet, and to provide a method of manufacturing the bonding sheet. SOLUTION: Since the sufficient amount of para-system alamide single fiber contained in the hardened substance of epoxy resin constituting a resin layer of a bonding sheet for laminated layer plate including an internal layer circuit used for the laminated layer plate having the internal layer circuit which is formed by laminating and integrating, to ensure mutual contact, the bonding sheet for laminated layer plate including the internal layer circuit formed by using a para-system alamide single fiber dispersion epoxy resin compound and an internal layer material including an internal layer circuit forming surface, the thermal expansion coefficient of an insulating layer of the bonding sheet for laminated layer plate including the internal layer circuit can be reduced. Moreover, a difference between the thermal expansion coefficient of a silicon chip and that of the insulating layer can also be reduced. As a result, contribution can further be achieved for the improvement of component mounting reliability. COPYRIGHT: (C)2004,JPO |
