| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board which can surely manufacture a core board having through holes and the wiring board including a build-up layer on the upper surface thereof by the small number of steps of a lower price. SOLUTION: This wiring board manufacturing method comprises a step of forming through holes 5 that penetrate the surface 2a and the rear surface 2b of the core board having the surface 2a and the rear surface 2b, through hole conductors 6 and a rear surface wiring layer 9 on the rear surface 2b; and a laminating step for providing a pair of core boards 2, 2, where an adhesive layer (prepreg) 11 is formed on the rear surface 2b of the core board 2, opposing to respective adhesive layers 11 and the then laminating these boards via a separation sheet (r), and then forming a filling resin 7 by filling a hollow formed at the internal side of the through hole conductor 6 with a part of the adhesive layer 11 by giving pressure and heat thereto. COPYRIGHT: (C)2004,JPO |
