| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which has excellent low-temperature adhesiveness, resistance to moist heat and is suitable as a heat-resistant adhesive. SOLUTION: The resin composition comprises 70-99 wt.% of a polyimide resin and 1-30 wt.% of a specific bismaleimide compound represented by general formula (1) (R<SP>1</SP>and R<SP>2</SP>are each a hydrogen atom, a halogen atom, a lower alkoxy group or a hydrocarbon group; R is an aromatic ring-containing specific group). The polyimide film, the adhesive insulation tape and the metal laminate comprise layers composed of the resin composition. COPYRIGHT: (C)2004,JPO |
