CLAMPING FORCE MEASURING APPARATUS OF MOLDING PRESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A clamping force measuring apparatus of a molding press for manufacturing a semiconductor package is provided to be capable of automatically measuring and displaying the clamping force between an upper and lower part of the molding press. CONSTITUTION: A clamping force measuring apparatus of a molding press for manufacturing a semiconductor package is provided with a distance measuring sensor(50) for measuring the first distance to the end portion of a sub tie load, a PLC(Programmable Logic Controller)(60) connected with the output port of the distance measuring sensor for calculating the clamping force between an upper and lower part of the molding press according to the first distance and transforming the calculated value into an electric signal, and a display part for displaying the clamping force between the upper and lower part of the molding press. Preferably, an A/D(Analog to Digital) converter(80) is between the distance measuring sensor and the PLC.