AUTOMATIC INSPECTING APPARATUS AND AUTOMATIC INSPECTING METHOD OF CRYSTAL DEFECT

摘要

PROBLEM TO BE SOLVED: To provide an automatic inspecting method of crystal defects by which an automatic operation is possible to reduce the burden of an operator, and the crystal defects in the semiconductor crystal can be stably inspected with high accuracy without fluctuations in inspection results, and to provide an automatic inspecting apparatus.

SOLUTION: This method for automatically inspecting the crystal defects in the semiconductor crystal comprises steps of: selectively etching a semiconductor wafer prepared by slicing a semiconductor crystal grown by a Czochralski (CZ) method or the floating zone (FZ) method so that parabolic pattern defects (FPD) appear on the surface of the semiconductor wafer; obtaining image data by picking up the image of the surface of the semiconductor wafer and converting parabolic pattern defects (FPD) in the image data into independent parabolas by performing image processing for the image data; and quantifying the crystal defects by automatically discriminating the independent parabolas.

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