| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate bonding method for efficiently suppressing a void occurred in an adhesive when a substrate where a fine projecting part exists is bonded to the other substrate and for bonding the substrates with good flat precision. SOLUTION: A surface coating layer is formed on the projecting part of the first substrate where the projecting part is formed on a surface. A plurality of space holding members are formed on the surface coating layer. A first adhesive film formed of a film layer and an adhesion layer is bonded to a face opposite to an adhesion face of the first substrate. A second adhesive film formed of a film layer and an adhesion layer is bonded to a face opposite to an adhesion face of the second substrate. The adhesive is applied to the surface coating layer, the second substrate is arranged on the adhesive, and the surface coating layer is bonded to the second substrate. COPYRIGHT: (C)2004,JPO
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