发明名称 POLISHING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polishing technology capable of suppressing the occurrence of scratching, peeling, dishing, and erosion and suppressing the costs of expendables such as abrasive and polishing cloth without requiring a complicated cleaning process or an abrasive supplying/processing device. <P>SOLUTION: A metallic film 21 formed on the surface of an insulating film 23 having grooves is polished by a polishing solution containing substances capable of dissolving oxidizing substances and oxides into water and not containing grinding grains. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003324084(A) 申请公布日期 2003.11.14
申请号 JP20030115184 申请日期 2003.04.21
申请人 HITACHI LTD 发明人 KONDO SEIICHI;HONMA YOSHIO;SAKUMA NORIYUKI;TAKEDA KENICHI;HINODE KENJI
分类号 B24B37/00;C09K3/14;H01L21/304;H01L21/306;H01L21/3205;H01L21/321;H01L21/768;H01L23/52;H01L23/532;(IPC1-7):H01L21/304;H01L21/320 主分类号 B24B37/00
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