发明名称 |
ELECTROSTATIC CHUCK AND LAMINATION DEVICE FOR FLAT PANEL SUBSTRATE USING IT |
摘要 |
PROBLEM TO BE SOLVED: To surely switch the suction holding of a substrate by a suction force to the attraction holding of the substrate by a electrostatic attraction force while simplifying a structure, and to laminate it. SOLUTION: Both substrates A, B or either thereof is sucked and held by a suction means 3' and is attracted in the air by an electrostatic chuck 3 before the suction force by the suction means 3' disappears in a process proceeding decompression. After a prescribed vacuum degree is attained, both the substrates A, B are laminated. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2003324144(A) |
申请公布日期 |
2003.11.14 |
申请号 |
JP20020128866 |
申请日期 |
2002.04.30 |
申请人 |
SHIN-ETSU ENGINEERING CO LTD |
发明人 |
OTANI YOSHIKAZU;YOKOTA MICHIYA;NISHIZAWA TATSU;UCHIYAMA KAZUE;ISHIZAKA ICHIRO |
分类号 |
G02F1/13;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 |
主分类号 |
G02F1/13 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|