发明名称 ELECTROSTATIC CHUCK AND LAMINATION DEVICE FOR FLAT PANEL SUBSTRATE USING IT
摘要 PROBLEM TO BE SOLVED: To surely switch the suction holding of a substrate by a suction force to the attraction holding of the substrate by a electrostatic attraction force while simplifying a structure, and to laminate it. SOLUTION: Both substrates A, B or either thereof is sucked and held by a suction means 3' and is attracted in the air by an electrostatic chuck 3 before the suction force by the suction means 3' disappears in a process proceeding decompression. After a prescribed vacuum degree is attained, both the substrates A, B are laminated. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003324144(A) 申请公布日期 2003.11.14
申请号 JP20020128866 申请日期 2002.04.30
申请人 SHIN-ETSU ENGINEERING CO LTD 发明人 OTANI YOSHIKAZU;YOKOTA MICHIYA;NISHIZAWA TATSU;UCHIYAMA KAZUE;ISHIZAKA ICHIRO
分类号 G02F1/13;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 G02F1/13
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