| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor power module which attains size reduction and high-precision wire bonding. SOLUTION: The semiconductor power module 2 is provided with a case 6 having an open upper end and arranged inside with a power semiconductor chip, and a cover 8 for covering the opening of the case 6. Electrode terminals 34a, 34b and 34c which are electrically connected to the power semiconductor chip are drawn out to the outside and bent along the upper surface of the cover 8. The cover 8 is mounted on the case 6 so as to slide along the opening end of the case 6. By such an arrangement, since wire bonding can be carried out in a state that the electrode terminals 34a, 34b and 34c are bent, a wire bonding tool can be shortened. COPYRIGHT: (C)2004,JPO |
