SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, MOUNTING SUBSTRATE DEVICE AND WIRING CUTTING METHOD OF THE MOUNTING SUBSTRATE DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device which can prevent element breakdown caused by electrostatic discharge and prevent the propagation of power supply noise to an analog circuit caused by digital circuit operation. SOLUTION: The device has a power supply wiring VDD which supplies power supply potential to a digital circuit; ground wiring VSS which supplies ground potential to the digital circuit; protection circuits TDN1, TDP1 which are connected between the power supply wiring VDD and the ground wiring VSS and protect the digital circuit; power supply wiring VDD-A which supplies power supply potential to the analog circuit; ground wiring VSS-A which supplies ground potential to the analog circuit; protection circuits TAN1, TAP1 which are connected between the power supply wiring VDD-A and the ground wiring VSS-A, and protect the analog circuit; and an element F1 or F2 which is provided at least either space between the power supply wiring GDD and the power supply wiring VDD-A, or between the ground wiring VSS and the ground wiring VSS-A, and brings the space into a cut state. COPYRIGHT: (C)2004,JPO