| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic substrate and the manufacturing method of the same high in an yield and reliability. <P>SOLUTION: The ceramic substrate 101 is provided with a main surface 102, a rear surface 103, solder dumps 127 formed on the main surface 102, a main surface metallized layer 123 formed on the main surface 102, and a rear surface metallized layer 125 formed on the rear surface 103. In this case, the summit of the solder bump 127 is flattened and the main surface metalized layer 123 is formed so as to be thinner than the rear surface metallized layer 125. Further, the warpage of the substrate is specified within a range from -1 μm/mm to +4 μm/mm with the direction of the warpage wherein the rear surface 103 side is projected as a positive direction, while the direction of the warpage wherein the main surface 102 side is projected as a negative direction. <P>COPYRIGHT: (C)2004,JPO |
