| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method capable of reducing incomplete filling or a void by a simple structure to manufacture a high-grade semiconductor device with high productivity. <P>SOLUTION: The semiconductor device manufacturing method has a mount step of mounting a plurality of electronic parts at predetermined spots of a substrate previously formed with a wiring pattern, a bulkhead formed step of forming a bulkhead on the substrate between the plurality of electronic parts, and a resin sealing step of injecting a resin on the substrate formed with the bulkhead and sealing. <P>COPYRIGHT: (C)2004,JPO</p> |
