| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To densify a printed wiring board by improving the connection reliability of a circuit component 3, related to a single-sided, double-sided or multilayer printed wiring board in which the circuit component 3 is buried, and a method for manufacturing it. <P>SOLUTION: An electrode 3a of the circuit component 3 is formed of an elementary substance of Ni, Cr or Ti, or an alloy of them. A through hole 2 or a counter boring part 9 is formed in a substrate 1 to form a burying part. A form thereof is so set that the circuit component 3 can be pressed therein. The surface of the electrode 3a is recessed from the surface of the substrate 1 by 10-50μm. The electrode 3a is connected to a wiring pattern 6A1 formed of a copper layer 6A while adjoining the electrode 3a in the thickness direction of the substrate with the copper layer 6A. The copper layer 6A is the same copper layer that is formed on the surface of a through hole 4, a via hole 8 or an inner via hole 4A. <P>COPYRIGHT: (C)2004,JPO</p> |
