| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a small, light and thin complex semiconductor module of high-density wiring and high performance by reducing the distance between elements with the incorporation of both a semiconductor element and a passive element and by eliminating defects ascribed to wiring resistance or inductance. <P>SOLUTION: The complex semiconductor module has such as arrangement that an organic circuit board for mounting a semiconductor element, such as an IC, is stacked on and integrated with at least one face of a low temperature co-fired ceramic substrate which incorporates a passive element such as a condenser. <P>COPYRIGHT: (C)2004,JPO</p> |
