| 摘要 |
PROBLEM TO BE SOLVED: To provide an installing structure for fixing an electronic device such as a semiconductor pressure sensor to a prescribed fixing surface via an adhesive layer having a uniform thickness capable of relieving external stress. SOLUTION: This installing structure is for fixing the electronic device 11 to the fixing surface 13 via the adhesive layer 10. The electronic device installing structure is characterized in that the adhesive layer 10 includes a large number of spherical particles 14 having substantially the uniform particle size. COPYRIGHT: (C)2004,JPO
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