| 摘要 |
PROBLEM TO BE SOLVED: To reduce a time for processing an image data and quickly inspect defects on surfaces of semiconductor chips accommodated in a tray. SOLUTION: A tray mounting part 61 for mounting and fixing the small tray 2 is provided on a platform 60. Elevation mechanisms 62a, 62b, 62c, 62d elevate four corners of the platform 60 and incline the small tray 2. Vibrators 63a, 63b, 63c, 63d vibrate the small tray 2. Each semiconductor chip 1 accommodated in the small tray 2 moves within an accommodating part of the small tray 2 in one direction by a vibration applied in an inclined state of the small tray 2 and is approximately aligned with the same position within each accommodating part. COPYRIGHT: (C)2004,JPO
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