| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy for wiring connection which has suppression effects on the occurrence of scintillation and the formation of carbonized tracks and which has excellent electric conductivity, proof stress, stress relaxation and contact resistance as well. SOLUTION: The copper alloy has a composition containing, by mass, 1.6 to 2.4% Fe, 0.02 to 0.2% Si, 0.2 to 3.0% Zn, 0.01 to 0.4 Mg and 0.01 to 0.2% Sn, <0.01% P,≤0.03% Ni≤0.03% Mn, and the balance Cu with impurities. The copper alloy may further contain 0.0005 to 0.015% Pb or/and one or more kinds of metals selected from the group of Al, Ag, Cr, Ti and Be by≤1% in total. As for the impurities, the contents of Bi, As, Sb and S are individually controlled to≤0.003%, and their total is also controlled to≤0.005%. Further, the content of O is controlled to≤10 ppm, and H to≤20 ppm. COPYRIGHT: (C)2004,JPO
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