RING TYPE BOAT TOP COVER OF SEMICONDUCTOR PROCESSING EQUIPMENT

摘要

PURPOSE: A ring type boat top cover of semiconductor processing equipment is provided to be capable of reducing a thin film melted to the ring type boat top cover when carrying out a poly process for minimizing the generation of particles due to the increase of the thin film accumulated at the ring type boat top cover. CONSTITUTION: A ring type cover(20) is installed at the upper portion of a boat, wherein the boat is used for stably loading a wafer. Preferably, the ring type boat top cover is capable of minimizing the generation of particles by reducing the size of a thin film melted on the ring type boat top cover when carrying out a poly process. At this time, the boat is made of quartz.