| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability when mounted on a circuit substrate. <P>SOLUTION: The circuit substrate, an adhesive layer having high adhesion and a solder bump are formed on the surface of the semiconductor device. Adhesion strength required for being mounted on the circuit substrate of the semiconductor device is supplied by the adhesive layer. Electric connection is provided by the solder bump, thereby providing the structure of the semiconductor device having higher reliability than in a prior art. <P>COPYRIGHT: (C)2004,JPO</p> |
