发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste which exhibits good wettability by solder, does not lower junction strength and can form an electrode having a high specific resistance. SOLUTION: The conductive paste comprises silver powder, glass frit and an organic vehicle, and at least 50% by weight of the silver powder is silver powder having a particle diameter of 4.5-7μm and a crystallite diameter of 100 nm or greater. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003323815(A) 申请公布日期 2003.11.14
申请号 JP20020127367 申请日期 2002.04.26
申请人 MURATA MFG CO LTD 发明人 ADACHI FUMIYA
分类号 B60J1/20;H01B1/16;H01B1/22;(IPC1-7):H01B1/22 主分类号 B60J1/20
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