| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electrical connection body of a circuit pattern of a printed circuit board in which a space occupied by the electrical connection body is reduced and the quality of a manufacturing process can be improved. SOLUTION: A circuit board 10 including a conductive layer 20 on one surface is prepared. The conductor layer is formed as a circuit pattern 11, a first part 12 and a second part 13 are provided on the circuit pattern 11, and the first part 12 is provided at a position higher than the second part 13 with a difference in height between the first part 12 and the second part 13. When the circuit pattern 11 is reduced in thickness by removing a part of the predetermined portion of the circuit pattern 11, the thinner portion of the circuit pattern 11 becomes the second part 13, while the other thick portion becomes the first part 12. When an insulating layer is provided, it covers the second part 13 of the circuit pattern 11 but the first part 12 is exposed. When the insulating layer is provided, it covers the second part 13 of the circuit pattern 11 but the first part 12 is exposed. COPYRIGHT: (C)2004,JPO |
