| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin material for sealing not containing a halogen and antimony, having good flame retardance without lowering reliability of moldability, reflow resistance, moisture resistance and high-temperature leaving characteristics, etc., and an electronic part apparatus equipped with an element sealed thereby. SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin, (B) a curing agent and (C) a complex metal hydroxide as essential components and has≤200 kPa shearing mold release force within 10 shots. The electronic part apparatus is equipped with the element sealed by the epoxy resin molding material for sealing. COPYRIGHT: (C)2004,JPO
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