发明名称 |
METHOD FOR FABRICATING MULTI-CHIP PACKAGE SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device includes a substrate (101); a first semiconductor chip (102) mounted on the substrate; and a first insulating layer (105) which is provided on the first semiconductor chip. The device further includes a metal layer (102) which is provided on the first insulating layer; a second insulating layer (117) which is provided on the metal layer; and a second semiconductor chip (104) which is provided on the second insulating layer.
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申请公布号 |
US2003211656(A1) |
申请公布日期 |
2003.11.13 |
申请号 |
US20030412557 |
申请日期 |
2003.04.14 |
申请人 |
UCHIDA YASUFUMI |
发明人 |
UCHIDA YASUFUMI |
分类号 |
H01L21/48;H01L23/538;H01L23/552;H01L25/065;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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