发明名称 |
MEMS device wafer-level package |
摘要 |
A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.
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申请公布号 |
US2003211654(A1) |
申请公布日期 |
2003.11.13 |
申请号 |
US20020135559 |
申请日期 |
2002.04.29 |
申请人 |
TEXAS INSTRUMENTS INC. |
发明人 |
KOCIAN THOMAS A.;KNIPE RICHARD L.;STRUMPELL MARK H. |
分类号 |
B81C99/00;(IPC1-7):H01L21/44 |
主分类号 |
B81C99/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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