发明名称 Flip chip testing
摘要 An integrated circuit having circuit structures, including at least one of logic elements and memory elements. A core is disposed at an interior portion of the integrated circuit. The core contains core power contacts and core ground contacts for providing electrical power to the circuit structures during functional operation of the integrated circuit. A peripheral is disposed at an edge portion of the integrated circuit. The peripheral contains signal contacts for sending and receiving electrical signals between the circuit structures and external circuitry. The peripheral also has peripheral power contacts and peripheral ground contacts for providing electrical power to the circuit structures during testing of the integrated circuit. The peripheral power contacts are redundant to at least some of the core power contacts, and the peripheral ground contacts are redundant to at least some of the core power contacts.
申请公布号 US2003211641(A1) 申请公布日期 2003.11.13
申请号 US20030462524 申请日期 2003.06.16
申请人 LSI LOGIC CORPORATION 发明人 WRIGHT PETER J.;ZARKESH-HA PAYMAN
分类号 H01L23/58;(IPC1-7):H01L21/66 主分类号 H01L23/58
代理机构 代理人
主权项
地址