Controlled neck growth process for single crystal silicon

摘要

A process for preparing a single crystal silicon in accordance with the Czochralski method, is provided. More specifically, by quickly redueing the pull rate at least once during the growth of a neck portion of the single crystal silicon ingot, in order to change the melt/solid interface shape from a concave to a convex shape, the present process enables zero dislocation growth to be achieved in a large diameter neck within a comparably short neck length, such that large diameter ingots of substantial weight can be produced safely and at a high throughput.