| 摘要 |
<p>A high-frequency power module assembled in a portable telephone and incorporating a high-frequency unit analog signal processing IC including a low-noise amplifier for amplifying a weak signal. A semiconductor device comprises an encapsulating body made of an insulating resin, leads extending inside and outside the encapsulating body, a tab provided in the encapsulating body and having a semiconductor element fixing area and a wire connection area on one major surface, a semiconductor element fixed to the semiconductor element fixing area and having electrode terminals on an exposed major surface, conductive wires for connecting the electrode terminals of the semiconductor element to the leads, and conductive wires for connecting the electrode terminals to the wire connection area of the tab. A circuit is monolithically fabricated in the semiconductor element and composed of circuit sections. In a specific circuit section (low-noise amplifier), a part of the circuit sections, all the grounding electrode terminals out of the electrode terminals of the semiconductor element are not connected to the tab through wires, and connected to the leads through the wires.</p> |
