发明名称 Process for thick film circuit patterning
摘要 A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer is applied onto a substrate surface. The photosensitive layer is imaged with a pattern using actinic radiation, the exposed areas of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet will cause the thick film to adhere to the remaining tacky areas. Upon peeling the sheet, a thick film print pattern will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.
申请公布号 US2003211406(A1) 申请公布日期 2003.11.13
申请号 US20020275183 申请日期 2002.11.01
申请人 KEUSSEYAN ROUPEN LEON 发明人 KEUSSEYAN ROUPEN LEON
分类号 G03F7/004;G03F7/34;H05K1/09;H05K3/04;H05K3/20;(IPC1-7):B32B3/10;G03F7/038;G03F7/09;B32B7/06;G03F7/16;G03F7/40;B05D5/12 主分类号 G03F7/004
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