SUBMOUNT AND SEMICONDUCTOR DEVICE

摘要

A submount capable of a high-bonding-strength mounting of a semiconductor light emitting element. The submount comprises a submount substrate, a solder layer formed on the main surface of the submount substrate, and, held therebetween, a solder bonding layer consisting of, layered from the submount substrate side, a transition element layer mainly containing at least one kind of transition element, and a noble metal layer mainly containing at least one kind of noble metal. A semiconductor device is provided with a semiconductor light emitting element mounted on the solder layer of the submount.