| 摘要 |
Conductive, semiconductive or insulating patterns such as fine line, thick film circuitry, or dot configurations are applied to electronic component substrates from a continuous transfer tape. In the transfer tape the patterns are formed with prearranged spacing on a heat decomposable carrier film, which in turn is supported on a backing strip and covered by a protective strip. In use the protective strip is peeled off and the patterns, still adhered to the carrier film and supported by the backing strip, are adhesively secured to a group or a continuously fed series of pre-aligned substrates. The backing strip is then peeled off, and the substrates with the applied patterns, now supported only by the heat decomposable carrier film, are placed in an oven for sintering and decomposition of the carrier film. The transfer tape and method of the invention lend themselves readily to automated, production-line procedures.
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