| 发明名称 |
Process for treating a conductive surface and products formed thereby |
| 摘要 |
The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an electrolytic process to deposit a silicate containing coating or film upon a metallic or conductive surface.
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| 申请公布号 |
US2003209290(A1) |
申请公布日期 |
2003.11.13 |
| 申请号 |
US20020211094 |
申请日期 |
2002.08.02 |
| 申请人 |
HEIMANN ROBERT L.;POPOV BRANKO;FLINT BRUCE;HEIMANN NANCY G.;CHANDRAN RAVI;DALTON WILLIAM M. |
发明人 |
HEIMANN ROBERT L.;POPOV BRANKO;FLINT BRUCE;HEIMANN NANCY G.;CHANDRAN RAVI;DALTON WILLIAM M. |
| 分类号 |
C25D9/08;(IPC1-7):C23C22/60 |
主分类号 |
C25D9/08 |
| 代理机构 |
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