| 摘要 |
<p>An electrolytic polishing method in which conductivity is enhanced without causing aggregation or precipitation of abrasive grains and good planarization is realized without causing any defect in a metal film or wiring to be polished. In the electrolytic polishing method for planarizing the surface of a metal film to be polished by sliding a polishing pad (15) on the surface of the metal film in electrolytic polishing liquid E while oxidizing, the electrolytic polishing liquid E contains at least abrasive grains and an electrolyte for sustaining charged state of the abrasive grains. Since an electrolytic polishing liquid exhibiting high conductivity is employed, a high electrolytic current level can be attained and the inter-electrode distance can be increased. Since an electrolytic polishing liquid exhibiting good dispersion state of abrasive grains is employed, such defects as residual abrasive grain or scratch are eliminated.</p> |
