METAL LINE HAVING DIFFUSION BARRIER AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A metal line having a diffusion barrier and a method for manufacturing the same are provided to be capable of improving the characteristics of the diffusion barrier and preventing the deterioration of conductivity by using a double layer made of Ti/TiN or Ta/TaN, and a triple layer made of W and WN. CONSTITUTION: A metal line is provided with the first barrier(114) formed at the inner portion of a connecting hole and an exposed lower metal line(102), the second barrier(116) formed at the upper portion of the first barrier, a copper seed layer formed on the second barrier, and a copper metal line connected with the exposed lower metal line. Preferably, the first barrier is a double layer structure made of Ti/TiN. Preferably, the second barrier is a triple layer structure made of W/WN/W.