Method for manufacturing electronic circuits integrated on a semiconductor substrate

摘要

A method for manufacturing semiconductor-integrated electronic circuits (CI) comprising the steps of: depositing an auxiliary layer (30) on a substrate (20); depositing a layer (40) of screening material on the auxiliary layer (30); selectively removing the layer (40) of screening material to provide a first opening (41) in the layer (40) of screening material and expose an area of the auxiliary layer (30); and removing this area of the auxiliary layer (30) to form a second opening (31) in the auxiliary layer (30), whose cross-section narrows toward the substrate (20) to expose an area of the substrate (20) being smaller than the area exposed by the first opening (41).