| 摘要 |
A highly reliable, low cost packaging system for one or more semiconductor chips each having metal contact pads on at least one face. A rigid support is provided for the semiconductor chip and also the large leads which are used to connect the packaged device in an external circuit. A set of thin metallic film strips are bonded to a thin flexible dielectric sheet for support. The set of metal strips interconnects the contact pads on the semiconductor chips and selected leads to electrically interconnect the semiconductor device and the leads. Where a plurality of semiconductor devices are used, a plurality of dielectric sheets can be stacked and electrical connections made between the different layers of metal film strips through openings in the dielectric sheets. Several processes for assembling the packages are also described.
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