| 摘要 |
An optic semiconductor package includes a plate shaped substrate having an insulation layer through which two spaced apart layer apertures are formed. The substrate further includes a plurality of electrically conductive patterns formed on the wall surfaces of the layer apertures and a lower surface of the insulation layer. One of a laser diode and a photo detector are disposed in a different one of the two layer apertures and are each electrically connected to the electrically conductive patterns through conductive bumps formed on the laser diode and the photo detector. An insulation plate, having a plurality of plate apertures formed through portions of the insulation plate adjacent to the electrically conductive patterns, is coupled to the lower surface of the substrate. One of a plurality of conductive pins electrically connected with the electrically conductive patterns is fitted in each of the plate apertures of the insulation plate and extends downward from the insulation plate. An integral metal cap is attached to upper and side portions of the substrate to protect the substrate, the laser diode, and the photo detector from the outside environment. The metal cap has an opening formed in its ceiling. A glass is attached below the opening to enable light to be transmitted through the glass from the laser diode to an exterior device and from an exterior device to the photo detector.
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