Ball attached zero insertion force socket

摘要

A system and method for mechanically and electrically connecting an electronic component and a circuit substrate using a Zero Insertion Force (ZIF) socket. The ZIF socket having a plurality of press-fit contact assemblies and a housing with middle plate that is selectively movable between a contact and non-contact position. Each contact assembly being secured to the ZIF socket housing by press-fitting the lower portion of the contact assembly such that each contact assembly is anchored to an aperture in the housing bottom by compressive force. The ZIF socket is mounted to the circuit substrate and the electronic component is mounted on to the ZIF socket. The contact assemblies of the ZIF socket are selectively movable between a contact and non-contact position. The press-fit contact assemblies form a seal to prevent solder wick-up.