| 摘要 |
The optical module 10 of the present invention comprises a semiconductor optical device 14, a package 12 containing the semiconductor device, and lead terminals 22. The package 12 comprises a bottom member 34 and a side member 36. The bottom member contains a device mounting surface S2, the side member mounting surface S3, and a lead terminal joining surface S1. The optical semiconductor device 14 is mounted on the device mounting surface S2 and lead terminals are joined to the lead terminal joining surface S1.
|
