| 摘要 |
A method of manufacturing a micromechanical component has a substrate ( 1 ), a movable sensor structure ( 6 ) in a micromechanical functional layer ( 5 ) located over the substrate; a first sealing layer ( 8 ) on the first micromechanical functional layer ( 5 ) which is at least partly structured; a second micromechanical functional layer ( 10 ) on the first sealing layer ( 8 ), which has at least one sealing function and is anchored at least partly in the first micromechanical functional layer ( 5 ); and a second sealing layer ( 8 ) on the second micromechanical functional layer ( 10 ). The sensor structure ( 6 ) is provided with trenches ( 7 ) whose width is not larger than a maximum trench width ( 66 ), which is sealable by the first sealing layer ( 8 ) in the form of plugs ( 9 ) which do not extend to the trench bottoms. |
