发明名称 Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
摘要 A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface; and electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.
申请公布号 US6645557(B2) 申请公布日期 2003.11.11
申请号 US20010981587 申请日期 2001.10.17
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 JOSHI NAYAN H.
分类号 C23C18/22;C23C18/28;C23C18/30;H05K3/18;(IPC1-7):B05D3/10;B05D1/18 主分类号 C23C18/22
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