发明名称 |
METHOD AND APPARATUS FOR FORMING PASTE BUMP |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming many paste bumps having small height unevenness. SOLUTION: A curvature guide 70 is interposed at the rear side of a squeegee member 60 of the upper surface side of a flexible screen mask 20 for rubbing conductive paste 80 into and filling the paste 80. Since the mask 20 pressed to the surface of a copper foil 3 by passing the member 60 is separated along the lower edge 72 of the guide 70, the mask 20 is separated along a predetermined curve always during the squeegee operation. As a result, the forming conditions of the many bumps 81 are made uniform to suppress the unevenness of the heights. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2003320640(A) |
申请公布日期 |
2003.11.11 |
申请号 |
JP20020237131 |
申请日期 |
2002.08.15 |
申请人 |
DAINIPPON PRINTING CO LTD;DT CIRCUIT TECHNOLOGY CO LTD |
发明人 |
KOBAYASHI ATSUSHI;UMEDA KAZUO;TSUNODA TAKESHI;SAKAMOTO AKIRA;SAWARA TAKAHIRO;TANAKA HITOSHI;NAGASHIMA MASAYUKI;ETO MINEAKI;SHIROGANE HIROYUKI;KAMEGAWA NAOTO;TERAUCHI TAKAYUKI |
分类号 |
B41F15/36;B41F15/40;(IPC1-7):B41F15/36 |
主分类号 |
B41F15/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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