发明名称 METHOD AND APPARATUS FOR FORMING PASTE BUMP
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming many paste bumps having small height unevenness. SOLUTION: A curvature guide 70 is interposed at the rear side of a squeegee member 60 of the upper surface side of a flexible screen mask 20 for rubbing conductive paste 80 into and filling the paste 80. Since the mask 20 pressed to the surface of a copper foil 3 by passing the member 60 is separated along the lower edge 72 of the guide 70, the mask 20 is separated along a predetermined curve always during the squeegee operation. As a result, the forming conditions of the many bumps 81 are made uniform to suppress the unevenness of the heights. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003320640(A) 申请公布日期 2003.11.11
申请号 JP20020237131 申请日期 2002.08.15
申请人 DAINIPPON PRINTING CO LTD;DT CIRCUIT TECHNOLOGY CO LTD 发明人 KOBAYASHI ATSUSHI;UMEDA KAZUO;TSUNODA TAKESHI;SAKAMOTO AKIRA;SAWARA TAKAHIRO;TANAKA HITOSHI;NAGASHIMA MASAYUKI;ETO MINEAKI;SHIROGANE HIROYUKI;KAMEGAWA NAOTO;TERAUCHI TAKAYUKI
分类号 B41F15/36;B41F15/40;(IPC1-7):B41F15/36 主分类号 B41F15/36
代理机构 代理人
主权项
地址