LED lamp package for packaging an LED driver with an LED

摘要

An LED lamp package for packaging an LED driver with an LED is provided. In one embodiment, the LED lamp package includes an LED driver chip and an LED chip, both of which are mounted on the ground lead of the LED lamp package and both of which are enclosed by the light transparent encapsulant of the LED lamp package. In another embodiment, the LED chip is mounted on top of the LED driver chip in the LED lamp package. In this embodiment, the LED driver chip includes an attachment pad, on which the bottom surface of the LED chip is mounted.