Semiconductor module having interconnected semiconductor chips disposed one above the other

摘要

A semiconductor module has a plurality of semiconductor chips which are provide on chip carriers in a housing. At least some of the semiconductor chips are disposed one above the other and there are conductive connections between the chip carriers of the semiconductor chips disposed one above the other. The conductive connections are formed by plug-in connections and extend through openings in the chip carriers. The openings may be lined with a conductive layer. In an alternative embodiment intermediate layers are provided between the semiconductor chips disposed one above the other. The intermediate layers have conductive projections which engage in the openings in the chip carriers for forming conductive connections.